众彩官网-(中国)股份有限公司




  1. Solar wafer AOI and high-speed sorting equipment

    众彩官网-(中国)股份有限公司

    Parameters

    Dimension

    10680*1600*2150mm

    Weight

    4630kg

    Rated power

    20kw

    Electric power

    AC380v/50hz

    Air pressure

    0.5~0.6mpa

    Functions and Performance

    Type

    Solar monocrystalline /polysilicon wafers cut by diamond thread

    Dimension

    157*157~230*230mm

    Thickness

    80-240um

    Defects

    Warping, bending, edge chipping,
    surface chipping, chamfer chipping,
    soiling, holes, hidden cracks

    Measurement item

    Thickness, Wire Marks, Resistivity, TTV,
    Roughness, Dimensions, PN Type

    CT(182*182mm)= 0.25s/pcs,WPH≥16000

    CT(210*210mm)= 0.3 s/pcs,WPH≥14000

    Workflow

    • Dimension/fragmentation inspection
      众彩官网-(中国)股份有限公司
    • Hidden crack inspection
      众彩官网-(中国)股份有限公司
    • Left and right chipping inspection
      众彩官网-(中国)股份有限公司
    • Chamfering and chipping inspection
      众彩官网-(中国)股份有限公司
    • Upper dirt inspection
      众彩官网-(中国)股份有限公司
    • Sorting and discharging
      众彩官网-(中国)股份有限公司
    • Front and rear chipping inspection
      众彩官网-(中国)股份有限公司
    • PN type/resistivity test
      众彩官网-(中国)股份有限公司
    • Thickness / wire mark / roughness inspection
      众彩官网-(中国)股份有限公司
    • Lower dirt inspection
      众彩官网-(中国)股份有限公司
    • Sorting and discharging
      众彩官网-(中国)股份有限公司
    • Dimension/fragmentation inspection
      众彩官网-(中国)股份有限公司
    • Front and rear chipping inspection
      众彩官网-(中国)股份有限公司
    • Hidden crack inspection
      众彩官网-(中国)股份有限公司
    • PN type/resistivity test
      众彩官网-(中国)股份有限公司
    • Left and right chipping inspection
      众彩官网-(中国)股份有限公司
    • Thickness / wire mark / roughness inspection
      众彩官网-(中国)股份有限公司
    • Chamfering and chipping inspection
      众彩官网-(中国)股份有限公司
    • Lower dirt inspection
      众彩官网-(中国)股份有限公司
    • Upper dirt inspection
      众彩官网-(中国)股份有限公司

    Advantages

    • 众彩官网-(中国)股份有限公司 Function and Performance Advantages

      Currently the industry's highest performance in terms of wafers per hour (WPH) is more than 16,000, which is much higher than the industry average of 10,000~12,000. Measurement accuracy reaches 0.8um, fragmentation rate is stable below 0.05%. Leakage rate < 0.1%. Overkill rate < 0.05%.

    • &#20247;&#24425;&#23448;&#32593;&#45;&#40;&#20013;&#22269;&#41;&#32929;&#20221;&#26377;&#38480;&#20844;&#21496; Electromechanical Advantages

      Feeding: two sets of cache mechanism seamlessly connects the feeding; compatible with multi-size flower baskets;Unloading: Bernoulli suspension type unloading device is adopted to ensure a very low fragmentation rate; parallel multiple independent unloading devices; seamless switching of unloading boxes.

      &#20247;&#24425;&#23448;&#32593;&#45;&#40;&#20013;&#22269;&#41;&#32929;&#20221;&#26377;&#38480;&#20844;&#21496;
    • &#20247;&#24425;&#23448;&#32593;&#45;&#40;&#20013;&#22269;&#41;&#32929;&#20221;&#26377;&#38480;&#20844;&#21496; Inspection Advantages

      Multi-station inspection of chipping and surface defects around the wafer, using a deep learning model that recognises the silicon material and completes the inspection with high accuracy.

      &#20247;&#24425;&#23448;&#32593;&#45;&#40;&#20013;&#22269;&#41;&#32929;&#20221;&#26377;&#38480;&#20844;&#21496;
    • &#20247;&#24425;&#23448;&#32593;&#45;&#40;&#20013;&#22269;&#41;&#32929;&#20221;&#26377;&#38480;&#20844;&#21496; Measurement Advantages

      Dual top and bottom line scanning cameras accurately identify thickness, flatness and line marks. Rejecting hidden cracks and fragments in advance of the inspection stage reduces the burden of subsequent downstream sorting.

      &#20247;&#24425;&#23448;&#32593;&#45;&#40;&#20013;&#22269;&#41;&#32929;&#20221;&#26377;&#38480;&#20844;&#21496;

    众彩官网-(中国)股份有限公司

    众彩官网-(中国)股份有限公司